Where would we be without Surface Mount Technology? 

Take a look around your home or office. Isn’t it amazing the amount of technology available that rule our lives? Including the computer or device that you are using to read this post. 

What drives these incredibly advanced devices that allow us to communicate with the rest of the world? Typically a Printed Circuit Board (PCB). 

How is a circuit board created? Surface Mount Technology

What is Surface Mount Technology? So glad you asked. 

Surface Mount Technology is the method where electronic components such as diodes, capacitors, and resistors are mounted to the surface of a Printed Circuit Board. Each component is safely secured to the circuit board with solder which creates a permanent bond. 

Over the years, Surface Mount Technology has largely replaced through-hole production due to the efficiency, speed and accuracy. 

New machinery is developed when there is new technological advancements.

Especially, for jobs that originally were done by hand such as through-hole circuit boards.

These machines turn these jobs into automated actions. Surface mount technology is a perfect example of such machinery.

Surface mount is a way of integrating components directly onto the surface of a printed circuit board.

Compact Automated Surface Mount Pick and Place 

Falconer Electronics is very happy to announce the addition of the DDM Novastar LE40V. This is a Benchtop Automated Pick and Place machine with Vision Centering.

Furthermore, the LE40V is here to increase productivity. Specifically, for larger orders. Especially, orders requiring tiny surface mount components.

Due to the need for higher volume of product in a shorter time we obtained the machine. The LE40V produces final product with efficiency and accuracy/ 

However, in addition to the larger volume we still need to be as flexible with the smaller runs as well as a higher mix of assemblies.

Furthermore, with the LE40V our quality improves. This is in addition to increasing our outflow as well as decreasing our lead times.

Our customers have come to expect the highest quality of standards. The addition of this new equipment ensures Falconer Electronics can continue to provide quality products at a superior level. 

Machinery System Features 

There are many features the LE40V which include the following:

  • Placement rate up to 3000cph with a +/- 0.001” accuracy.
  • Flexibility for those lower volume higher mix SMT PCB projects
  • Maximum travel area of 22” (560mm) x 22” (560mm)
  • Fine pitch capability of 15mil
  • Compact design
  • As well as, virtual placement of components
  • Self contained for maximum flexibility and economy of short or larger production runs.
  • Flexible feeders to accommodate reels or cut strip components

Advantages of Surface Mount LE40V

Surface Mount Pick and Place Machine

There are many advantages to the LE40V. The design does not take up an increased amount of floor space. The compact size makes it easy to integrate into our floor design.

There is an increase of the accuracy of surface mount placement on the printed circuit boards. This is due to, the Cognex® Vision System. This decreases errors. Therefore, the amount of reworks needed per board has also decreased.

This decrease can be attributed to the software that is standard with the machine. Also, the machine recognizes errors. As well as, self-diagnoses any issues during specific jobs.

The LE40V has a range of uses.

These uses include:

  • Component as small as the 0201package up to and including 2” (50mm) square body.
  • Handling loose components.
  • Also, it has the capability for tape and tube feeder.

In conclusion, the features of the LE40V are perfect for us at Falconer Electronics. Especially due to our focus on low volume – high mix production runs. 

Wrapping it Up 

To learn more about Ground Straps as well as the Wire Harness Assembly process, please click on the links below:

Lastly, check out our other blogs!

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